Technic presented on selective removal of post-etch residues at UCPSS Bi-Annual Symposium国民彩票客户端下载,国民彩票手机在线,国民彩票app平台
Cranston, RI, USA – Technic presented?a technical paper Customized Chemical Compositions Adaptable for Cleaning Virtually All Post-Etch Residues at the bi-annual UCPSS Symposium in Leuven, Belgium, held September 2-5, 2018.
The paper is a collaboration between Technic, STMicroelectronics, and CEA-Leti and was presented by Technic’s Technology and Innovation Director, Dr. Jerome Daviot. The presentation focused on an optimized cleaning solution to meet the challenges of post-etch residue removal of high-k materials such as tantalum, zirconium, and hafnium which are notoriously resilient and difficult to remove.?
About the Symposium
The UCPSS (Ultra Clean Processing of Semiconductor Surfaces) symposium is a bi-annual event devoted to cleaning and surface preparation for micro and nano-technology in electronic applications and related fields such as photovoltaics and bio-electronics.
It is the purpose of the UCPSS symposium to increase the level of understanding? on ultra-clean processing and surface preparation in all steps of the fabrication of ICs, PV-modules and bioelectronics devices. The conference consists of invited presentations, as well as selected contributing presentations and posters.
To learn more about UCPSS2018, go to http://www.ucpss.org